Hybrid Memory Cube (HMC) is a way of vertically stacking DRAM and connecting these using TSV.
- HMC DRAM can have around 3x to 5x higher bandwidth compared to the current DRAM
- It requires less area
- ARM, HP, Xilinx, Altera are in the consortium,
- Originally proposed by Micron
HMC 1.0: 10-15Gbps bandwidth, 15x faster than DDR3, 70% less energy, 90% less area
Logic chip under the stacked DRAMs control the schedule, and also includes serial communication interface between the memory and the CPU & GPU.
Byung Hoon Ahn 