[Memory] 3D Memory (TSV, HMC)

Hybrid Memory Cube (HMC) is a way of vertically stacking DRAM and connecting these using TSV.

  • HMC DRAM can have around 3x to 5x higher bandwidth compared to the current DRAM
  • It requires less area
  • ARM, HP, Xilinx, Altera are in the consortium,
  • Originally proposed by Micron

HMC 1.0: 10-15Gbps bandwidth, 15x faster than DDR3, 70% less energy, 90% less area

Logic chip under the stacked DRAMs control the schedule, and also includes serial communication interface between the memory and the CPU & GPU.

Reference

http://www.ddaily.co.kr/news/article.html?no=103089

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